The poor lateral and depth resolution of state-of-the-art 3D sensors based on the time-of-flight (ToF) principle has limited widespread adoption to a few niche applications. In this work, we introduce a novel sensor concept that provides ToF-based 3D measurements of real world objects and surfaces with depth precision up to 35<inline-formula><tex-math notation="LaTeX">$\mu m$</tex-math><alternatives><mml:math><mml:mrow><mml:mi>μ</mml:mi><mml:mi>m</mml:mi></mml:mrow></mml:math><inline-graphic xlink:href="li-ieq1-3075156.gif"/></alternatives></inline-formula> and point cloud densities commensurate with the native sensor resolution of standard CMOS/CCD detectors (up to several megapixels). Such capabilities are realized by combining the best attributes of continuous wave ToF sensing, multi-wavelength interferometry, and heterodyne interferometry into a single approach. We describe multiple embodiments of the approach, each featuring a different sensing modality and associated tradeoffs.