Anomaly Detection for Semiconductor Wafer Multi-wire Sawing Machines Using Statistical and Deep Learning Methods

Abstract Diamond multi-wire sawing machines are essential in semiconductor manufacturing, especially for slicing hard and brittle third-generation materials such as silicon carbide (SiC) and gallium nitride (GaN). The increased difficulty in processing these materials has highlighted the urgent need for reliable machine health monitoring and anomaly detection systems. While Predictive Maintenance and Prognostics and Health Management (PHM) frameworks have been widely applied across various industries, little research has specifically addressed semiconductor cutting equipment, where operational dynamics and data confidentiality present unique challenges. This study, in collaboration with an industry partner, develops two anomaly detection models tailored for diamond multi-wire sawing machines. The first model is a rule-based approach that utilizes sliding window techniques to extract statistical features and establish dynamic thresholds for anomaly detection. The second model employs a data-driven Univariate Autoencoder (UAE) to perform unsupervised anomaly detection by learning reconstruction errors from normal operating data. Both models are trained and validated using confidential industrial sensor datasets. Experimental results demonstrate that the UAE-based model achieves high detection accuracy with no observed false positives, providing an effective solution for enhancing operational reliability and production efficiency in semiconductor wafer slicing processes.