Development of Embedded Multi Si Bridge Package in Panel Level Process for HPC/AI Applications
With the recent growth of the High Performance Computing and Artificial Intelligence markets, demand for advanced package which can integrate multi-chip is increasing. The I-Cube E is a new platform of 2.3D package that overcome current constraints of large size heterogeneous integration by using Si bridges and panel level RDL technology. This paper offers an overview of 2.3D PLP PKG (I-Cube E) architecture and the core technologies in panel level process. To overcome the constraints of Panel level and Ultra Large size, we researched the core technologies such as accuracy of multi Si bridge, total thickness variation control, panel warpage control etc.
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Development of Embedded Multi Si Bridge Package in Panel Level Process for HPC/AI Applications
Semantic Scholar · 2025
Abstract
With the recent growth of the High Performance Computing and Artificial Intelligence markets, demand for advanced package which can integrate multi-chip is increasing. The I-Cube E is a new platform of 2.3D package that overcome current constraints of large size heterogeneous integration by using Si bridges and panel level RDL technology. This paper offers an overview of 2.3D PLP PKG (I-Cube E) architecture and the core technologies in panel level process. To overcome the constraints of Panel level and Ultra Large size, we researched the core technologies such as accuracy of multi Si bridge, total thickness variation control, panel warpage control etc.