Patent №
US 10,000,680
Granted
2018-06-19
Filed 2017
Owner
DOW CORNING CORPORATION
+1 more
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
15439644
Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
AI classification
Planning1.00
Vision0.00
Natural language0.00
AI hardware0.00
Speech0.00
Knowledge representation0.00
Evolutionary computation0.00
Machine learning0.00
Ownership
DOW CORNING CORPORATION
assignment · 438290746
DOW SILICONES CORPORATION
namechg · 454700188
Assignors
BHAGWAGAR, DORAB EDUL, MESSING, KELLY, WOOD, ELIZABETH
On an employer assignment, the assignors are typically the inventors.
From the same owner
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