Multi-Scale Correspondence Point Matching Using Constellation of Image Chips

Patent №

US 10,062,005

Granted

2018-08-28

Filed 2015

Owner

TELEDYNE SCIENTIFIC & IMAGING, LLC

Lab

AI components

4

ml · vision · kr · hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

14660254

A method of matching images A and B of the same scene taken at different locations in the scene is provided by matching correspondence points in the image by evaluating pixel characteristics from nearby regions using a constellation of image chips and utilizing joint information across multiple resolution levels in a probability framework. Since each image chip is small, each chip in one image potentially can be matched with a number of chips in the other image. The accumulation of evidence (probability) over all image chips within the constellation over multiple resolution levels reduces the ambiguity. The use of a constellation of image chips removes the requirement present in most visual point matching techniques to special feature points (e.g. corner points) as the correspondence points.

Machine learningVisionKnowledge representationAI hardwareG06T 7/33G06V 10/757G06T 2207/10012G06T 2207/10016G06T 2207/20016G06T 2207/20076

AI classification

Vision1.00
AI hardware1.00
Machine learning0.92
Knowledge representation0.59
Speech0.01
Evolutionary computation0.00
Planning0.00
Natural language0.00

Ownership

TELEDYNE SCIENTIFIC & IMAGING, LLC

assignment · 351850161

Assignors

ELIAZAR, AUSTIN I.

On an employer assignment, the assignors are typically the inventors.

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