Patent №
US 10,429,321
Granted
2019-10-01
Filed 2017
Owner
KLA-TENCOR CORPORATION
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
15671729
An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.
AI classification
Ownership
KLA-TENCOR CORPORATION
assignment · 438750738
Assignors
ZAMEK, STEVE, BROWN, DAVID L., IYER, VENKATRAMAN
On an employer assignment, the assignors are typically the inventors.