Apparatus for High-Speed Imaging Sensor Data Transfer

Patent №

US 10,429,321

Granted

2019-10-01

Filed 2017

Owner

KLA-TENCOR CORPORATION

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

15671729

An imaging sensor assembly includes at least one substrate including a plurality of substrate signal lines. The imaging sensor assembly also includes at least one imaging sensor package disposed on the at least one substrate, the at least one imaging sensor package including at least one imaging sensor disposed on at least one imaging sensor package substrate. The imaging sensor assembly also includes at least one receiver package disposed on the at least one substrate, the receiver package including at least one receiver integrated circuit disposed on at least one receiver package substrate. The imaging sensor assembly also includes at least one electrical interconnect operably coupled to the at least one imaging sensor package and the at least one receiver package. A plurality of data signals are transmitted between the at least one imaging sensor package and the at least one receiver package via the at least one electrical interconnect.

VisionG01N 21/9501G01T 1/24H04N 23/56H04N 25/711H10F 39/804H10F 39/811H01J 37/28H01J 2237/2441+2 more

AI classification

Vision0.75
Speech0.00
AI hardware0.00
Machine learning0.00
Natural language0.00
Knowledge representation0.00
Evolutionary computation0.00
Planning0.00

Ownership

KLA-TENCOR CORPORATION

assignment · 438750738

Assignors

ZAMEK, STEVE, BROWN, DAVID L., IYER, VENKATRAMAN

On an employer assignment, the assignors are typically the inventors.

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