THICKNESS MAPPING USING MULTISPECTRAL IMAGING

An example system includes a material transport system configured to transport a substantially planar material through a monitoring zone, an illumination source configured to illuminate at least a portion of the material that is within the monitoring zone with light, and a sensor configured to obtain a plurality of consecutive datasets. Datasets indicate, for locations of the material and for a specific wavelength of light, a respective intensity of the light that is of the wavelength and that is received from the location. The system also includes a processing system configured to receive the dataset, determine, based on the dataset and for each of at least two locations in the plurality of locations, a respective value of a thickness of the material, and execute, based on the respective value of the thickness of the material for at least one of the at least two locations, an action.