Thermal Insulation Material from Mycelium and Forestry Byproducts

Patent №

US 10,604,734

Granted

2020-03-31

Filed 2017

Owner

UNIVERSITY OF ALASKA ANCHORAGE

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

15418018

Disclosed are biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. Also disclosed are methods of making and using biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. For example, disclosed are methods of insulating an infrastructure comprising administering the disclosed biodegradable insulation materials to an infrastructure.

PlanningC12N 1/14E04B 1/76E04B 1/82G10K 11/162E01C 3/003E01C 3/06E02D 2300/0071E04B 2001/745+1 more

AI classification

Planning1.00
Machine learning0.02
Natural language0.02
AI hardware0.00
Knowledge representation0.00
Evolutionary computation0.00
Speech0.00
Vision0.00

Ownership

UNIVERSITY OF ALASKA ANCHORAGE

assignment · 463600632

Assignors

AMSTISLAVSKI, PHILIPPE, YANG, ZHAOHUI, WHITE, MARIA D.

On an employer assignment, the assignors are typically the inventors.

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