DIE AND PACKAGE

Provided efficiently and at low cost are: a package for core number ratios appropriate for all types of computers; and dies included in the package.This package includes at least one die provided with: at least one of a first core formed of a CPU core or a latency core and a second core formed of an accelerator core or a throughput core; an external interface; memory interfaces 24 to 26; and a die interface 23 which is connected to another die.The die includes a first type die and a second type die each including both the first core and the second core and the core number ratio between the first core and the second core in the first type die differs from that in the second type die.Moreover, the memory interfaces include an interface conforming to TCI.In addition, the memory interfaces further include an interface conforming to HBM.