DESIGN LAYOUTS FOR CONNECTING CONTACTS WITH METAL TABS OR VIAS

Patent №

US 10,691,862

Granted

2020-06-23

Filed 2017

Owner

GLOBALFOUNDRIES INC.

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

15644288

The present disclosure relates to methodologies for designing semiconductor structures, and, more particularly, creating a methodology to connect contacts of semiconductor elements to a metal line using marker tabs to reserve space for future connections between the contacts and the metal line, and then reassigning the marker tabs to connections between the contacts and the metal line on different levels of a metal stack formed over the semiconductor elements.

AI hardwareG06F 30/394H01L 23/5226H10W 20/42H10D 84/0149H10D 84/0151H10D 84/038

AI classification

AI hardware0.65
Natural language0.06
Planning0.03
Vision0.00
Machine learning0.00
Evolutionary computation0.00
Knowledge representation0.00
Speech0.00

Ownership

GLOBALFOUNDRIES INC.

assignment · 429340574

Assignors

NAYYAR, NEHA, DECHENE, DANIEL J., PRITCHARD, DAVID C., KLUTH, GEORGE J.

On an employer assignment, the assignors are typically the inventors.

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