Patent №
US 10,692,933
Granted
2020-06-23
Filed 2019
Owner
SAMSUNG ELECTRONICS CO., LTD.
Lab
—
AI components
1
ml
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16359146
A variable resistance memory device may include a first conductive line, a plurality of stacked structures, and a mold pattern. The first conductive line may be formed on a substrate. The plurality of stacked structures may be formed on the first conductive line, and each of the plurality of stacked structures includes a lower electrode, a variable resistance pattern, and a middle electrode stacked on one another. The mold pattern may be formed on the first conductive line to fill a space between the plurality of stacked structures. An upper portion of the mold pattern may include a surface treated layer and a lower portion of the mold pattern may include a non-surface treated layer.
AI classification
Ownership
SAMSUNG ELECTRONICS CO., LTD.
assignment · 486480286
Assignors
SEONG, DONG-JUN, PARK, YONG-JIN, PAIK, JUN-HWAN, OH, GYU-HWAN
On an employer assignment, the assignors are typically the inventors.