METHOD AND APPARATUS FOR CIRCUIT BOARD NOISE SHIELDING AND GROUNDING

The present disclosure relates to a printed circuit board (PCB) device and methods for fabricating a PCB device. In some aspects, the PCB device can comprise a surface or internal layer including one or more electrically conductive traces configured to carry a signal or power plane. The PCB device can also comprise at least one thin film comprising an electrically insulating material disposed on the surface or the internal layer. Additionally, the PCB device can comprise one or more electrically conductive layers on the at least one thin film. In some aspects, the one or more electrically conductive layers and the one or more electrically conductive traces can be separated by the at least one thin film in a configuration that defines a capacitive frequency response between the one or more electrically conductive layers and the one or more electrically conductive traces.