Substrate Materials for Quantum Processors

Patent №

US 10,985,308

Granted

2021-04-20

Filed 2020

Owner

RIGETTI & CO, INC.

Lab

AI components

2

ml · hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16741116

In a general aspect, an integrated microwave circuit is disclosed for processing quantum information. The integrated microwave circuit includes a substrate having a first surface and a second surface opposite the first surface. The substrate is formed of a silicon oxide material having a loss tangent no greater than 1×10−5 at cryogenic temperatures at or below 120 K. The integrated microwave circuit also includes qubit circuitry disposed on the first surface that includes a Josephson junction. A ground plane is disposed on the first surface or the second surface. In some variations, the silicon oxide material is fused silica. In other variations, the silicon oxide material is crystalline quartz.

Machine learningAI hardwareH10N 60/12G06N 10/40H10N 60/805H10N 60/815H10N 69/00

AI classification

AI hardware1.00
Machine learning0.94
Vision0.00
Knowledge representation0.00
Planning0.00
Evolutionary computation0.00
Speech0.00
Natural language0.00

Ownership

RIGETTI & CO, INC.

assignment · 515270845

Assignors

VODRAHALLI, NAGESH

On an employer assignment, the assignors are typically the inventors.

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