TETRACELL IMAGE SENSOR PREFORMING BINNING

Patent №

US 11,323,640

Granted

2022-05-03

Filed 2020

Owner

SAMSUNG ELECTRONICS CO., LTD.

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16815186

Systems and methods are described for a tetracell image sensor that performs diamond binning to process image data. An image sensor includes a pixel array and a converting circuit, where the pixel array includes pixel sets arranged in a row direction and a column direction, outputs a first signal generated from a first pixel set of the pixel sets, and outputs a second signal generated from a second pixel set of the pixel sets. The converting circuit performs binning based on the first signal and the second signal to generate a first binning signal. Each of the first pixel set and the second pixel set includes pixel sensors adjacent to each other, and the first pixel set and the second pixel set are located at different rows and different columns.

VisionH04N 25/46H04N 23/84H04N 25/134H04N 25/447H04N 25/78

AI classification

Vision1.00
AI hardware0.03
Evolutionary computation0.00
Natural language0.00
Speech0.00
Knowledge representation0.00
Machine learning0.00
Planning0.00

Ownership

SAMSUNG ELECTRONICS CO., LTD.

assignment · 520800468

Assignors

KIM, MOO YOUNG, KWON, MINHO, MIN, DONGKI, PARK, SEONGHYE, YI, EUNJIK

On an employer assignment, the assignors are typically the inventors.

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