Patent №
US 11,588,024
Granted
2023-02-21
Filed 2017
Owner
INFINEON TECHNOLOGIES AUSTRIA AG
+1 more
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
15462019
A semiconductor device includes a type IV semiconductor base substrate, a first type III-V semiconductor layer formed on a first surface of the base substrate, and a second type III-V semiconductor layer with a different bandgap as the first type III-V being formed on the first type III-V semiconductor layer. The semiconductor device further includes first and second electrically conductive device terminals each being formed on the second type III-V semiconductor layer and each being in ohmic contact with the two-dimensional charge carrier gas. The base substrate includes a first highly doped island that is disposed directly beneath the second device terminal and extends to the first surface of the base substrate. The first highly-doped island is laterally disposed between portions of semiconductor material having a lower net doping concentration than the first highly-doped island.
AI classification
Ownership
INFINEON TECHNOLOGIES AUSTRIA AG
assignment · 424790206
INFINEON TECHNOLOGIES AMERICAS CORP.
assignment · 424790311
Assignors
PAGNANO, DARIO, UDREA, FLORIN, CAMUSO, GIANLUCA, LONGOBARDI, GIORGIA, YANG, SHU
On an employer assignment, the assignors are typically the inventors.