Patent №
US 11,615,287
Granted
2023-03-28
Filed 2020
Owner
LG ELECTRONICS INC.
Lab
—
AI components
3
ml · planning · hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16777729
The present disclosure relates to an artificial intelligence chip for processing computations for machine learning models that provides a compute node and a method of processing a computational model using a plurality of compute nodes in parallel. In some embodiments, the compute node, comprises: a communication interface configured to communicate with one or more other compute nodes; a memory configured to store shared data that is shared with the one or more other compute nodes; and a processor configured to: determine an expected computational load for processing a computational model for input data; obtain a contributable computational load of the compute node and the one or more other compute nodes; and select a master node to distribute the determined expected computational load based on the obtained contributable computational load. Consequently, learning and inference can be performed efficiently on-device.
AI classification
Ownership
LG ELECTRONICS INC.
assignment · 516780034
Assignors
LEE, BYOUNGJOO, WOO, JEMIN, LEE, JINJONG, JUN, JUNGSIG
On an employer assignment, the assignors are typically the inventors.