PROCESSING COMPUTATIONAL MODELS IN PARALLEL

Patent №

US 11,615,287

Granted

2023-03-28

Filed 2020

Owner

LG ELECTRONICS INC.

Lab

AI components

3

ml · planning · hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16777729

The present disclosure relates to an artificial intelligence chip for processing computations for machine learning models that provides a compute node and a method of processing a computational model using a plurality of compute nodes in parallel. In some embodiments, the compute node, comprises: a communication interface configured to communicate with one or more other compute nodes; a memory configured to store shared data that is shared with the one or more other compute nodes; and a processor configured to: determine an expected computational load for processing a computational model for input data; obtain a contributable computational load of the compute node and the one or more other compute nodes; and select a master node to distribute the determined expected computational load based on the obtained contributable computational load. Consequently, learning and inference can be performed efficiently on-device.

Machine learningPlanningAI hardwareG06N 3/04G06N 3/0464G06N 3/08G06N 3/098G06N 3/10G06N 3/063

AI classification

AI hardware1.00
Machine learning1.00
Planning0.67
Knowledge representation0.08
Natural language0.01
Vision0.00
Evolutionary computation0.00
Speech0.00

Ownership

LG ELECTRONICS INC.

assignment · 516780034

Assignors

LEE, BYOUNGJOO, WOO, JEMIN, LEE, JINJONG, JUN, JUNGSIG

On an employer assignment, the assignors are typically the inventors.

From the same owner

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