Patent №
US 11,618,111
Granted
2023-04-04
Filed 2018
Owner
MITSUBISHI ELECTRIC CORPORATION
Lab
—
AI components
1
kr
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16302189
A method of manufacturing a plate-shaped solder according to the invention of the present application includes an aggregating step of aggregating a plurality of thread solders and a crimping step of crimping the plurality of aggregated thread solders to one another to form a plate-shaped solder. A manufacturing device of a plate-shaped solder according to the invention of the present application includes an aggregating portion for aggregating a plurality of thread solders and a crimping portion for crimping the plurality of thread solders to one another in the aggregating portion to form a plate-shaped solder.
AI classification
Ownership
MITSUBISHI ELECTRIC CORPORATION
assignment · 475220912
Assignors
UOZUMI, SHUJI, SAKUTANI, KAZUHIKO
On an employer assignment, the assignors are typically the inventors.