MARKING INTEGRATED CIRCUIT PACKAGE WITH ENCODED IMAGE FOR SCANNING TO OBTAIN MANUFACTURING PARAMETERS

Patent №

US 11,625,565

Granted

2023-04-11

Filed 2019

Owner

MICRON TECHNOLOGY, INC.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16408086

A package for an integrated circuit is marked with an encoded image (e.g., a two-dimensional barcode). The encoded image is scanned by a scanner to obtain manufacturing parameters. In one approach, a method includes: fabricating, in a manufacturing facility, a physical product using a manufacturing process, where the physical product is fabricated according to specifications, and the manufacturing process includes manufacturing steps performed in the manufacturing facility; marking the physical product with an encoded image, where the encoded image encodes parameters that include the specifications; and transporting the physical product to a storage facility, where the storage facility includes a scanner configured to scan the encoded image to obtain the parameters.

PlanningB42D 25/305G06K 19/06046G06K 19/022G06K 19/06037G06Q 50/04B41M 3/14Y02P 90/30

AI classification

Planning1.00
Vision0.01
AI hardware0.00
Evolutionary computation0.00
Natural language0.00
Knowledge representation0.00
Machine learning0.00
Speech0.00

Ownership

MICRON TECHNOLOGY, INC.

assignment · 500610547

Assignors

PRINCIPATO, GIUSEPPE

On an employer assignment, the assignors are typically the inventors.

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