MARKING INTEGRATED CIRCUIT PACKAGE WITH ENCODED IMAGE FOR SCANNING TO OBTAIN MANUFACTURING PARAMETERS
Patent №
US 11,625,565
Granted
2023-04-11
Filed 2019
Owner
MICRON TECHNOLOGY, INC.
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16408086
A package for an integrated circuit is marked with an encoded image (e.g., a two-dimensional barcode). The encoded image is scanned by a scanner to obtain manufacturing parameters. In one approach, a method includes: fabricating, in a manufacturing facility, a physical product using a manufacturing process, where the physical product is fabricated according to specifications, and the manufacturing process includes manufacturing steps performed in the manufacturing facility; marking the physical product with an encoded image, where the encoded image encodes parameters that include the specifications; and transporting the physical product to a storage facility, where the storage facility includes a scanner configured to scan the encoded image to obtain the parameters.
AI classification
Ownership
MICRON TECHNOLOGY, INC.
assignment · 500610547
Assignors
PRINCIPATO, GIUSEPPE
On an employer assignment, the assignors are typically the inventors.