Patent №
US 11,664,227
Granted
2023-05-30
Filed 2020
Owner
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
+1 more
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
17023940
A semiconductor structure and a method for forming the semiconductor structure are provided. The method includes providing a to-be-etched layer; forming an initial mask layer over the to-be-etched layer; forming a patterned structure, on the initial mask layer and exposing a portion of the initial mask layer; forming a barrier layer on a sidewall surface of the patterned structure; using the patterned structure and the barrier layer as a mask, performing an ion doping process on the initial mask layer to form a doped region and an un-doped region between doped regions in the initial mask layer; removing the patterned structure and the barrier layer; and forming a mask layer on a top surface of the to-be-etched layer by removing the un-doped region. The mask layer includes a first opening exposing the top surface of the to-be-etched layer.
AI classification
Ownership
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION
assignment · 538030914
SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
assignment · 538030914
Assignors
ZHANG, QIAN JIANG, SU, BO, DOU, TAO, SUN, LIN LIN
On an employer assignment, the assignors are typically the inventors.