SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF

Patent №

US 11,664,227

Granted

2023-05-30

Filed 2020

Owner

SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

+1 more

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

17023940

A semiconductor structure and a method for forming the semiconductor structure are provided. The method includes providing a to-be-etched layer; forming an initial mask layer over the to-be-etched layer; forming a patterned structure, on the initial mask layer and exposing a portion of the initial mask layer; forming a barrier layer on a sidewall surface of the patterned structure; using the patterned structure and the barrier layer as a mask, performing an ion doping process on the initial mask layer to form a doped region and an un-doped region between doped regions in the initial mask layer; removing the patterned structure and the barrier layer; and forming a mask layer on a top surface of the to-be-etched layer by removing the un-doped region. The mask layer includes a first opening exposing the top surface of the to-be-etched layer.

PlanningH01L 21/0332H10P 76/4088H01L 21/0335H01L 21/0337H10P 76/405H10P 76/4083H10P 76/4085

AI classification

Planning0.73
Natural language0.01
Evolutionary computation0.00
Speech0.00
AI hardware0.00
Machine learning0.00
Knowledge representation0.00
Vision0.00

Ownership

SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION

assignment · 538030914

SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION

assignment · 538030914

Assignors

ZHANG, QIAN JIANG, SU, BO, DOU, TAO, SUN, LIN LIN

On an employer assignment, the assignors are typically the inventors.

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