PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INTERFERENCE SHIELD

Patent №

US 11,670,599

Granted

2023-06-06

Filed 2020

Owner

QUALCOMM INCORPORATED

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

16925217

Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.

PlanningH01L 23/552H10W 42/20H01L 25/16H10W 44/401H10W 74/114H01L 2224/16227H01L 2924/15192H01L 2924/15311+5 more

AI classification

Planning1.00
Machine learning0.00
Natural language0.00
Evolutionary computation0.00
Speech0.00
Knowledge representation0.00
Vision0.00
AI hardware0.00

Ownership

QUALCOMM INCORPORATED

assignment · 555750236

Assignors

HAN, JEAHYEONG, RAE, DAVID FRASER, KUMAR, RAJNEESH

On an employer assignment, the assignors are typically the inventors.

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