PACKAGE COMPRISING PASSIVE DEVICE CONFIGURED AS ELECTROMAGNETIC INTERFERENCE SHIELD
Patent №
US 11,670,599
Granted
2023-06-06
Filed 2020
Owner
QUALCOMM INCORPORATED
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
16925217
Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.
AI classification
Ownership
QUALCOMM INCORPORATED
assignment · 555750236
Assignors
HAN, JEAHYEONG, RAE, DAVID FRASER, KUMAR, RAJNEESH
On an employer assignment, the assignors are typically the inventors.