METHOD AND APPARATUS FOR SETTING SEMICONDUCTOR DEVICE MANUFACTURING PARAMETER

Patent №

US 12,554,246

Granted

2026-02-17

Filed 2023

Owner

POSTECH ACADEMY-INDUSTRY FOUNDATION

Lab

AI components

0

Assignment

None on record

Dataset

AIPD

Application

18458896

Determining a semiconductor device manufacturing parameter may include determining an EPM (electrical measurement parameters) group that has a correlation in a baseline EPM dataset including EPMs of a device manufactured under a baseline condition, deriving principal components (PCs) corresponding to main correlation axes between EPMs in the EPM group, deriving a PC-based dataset including a baseline PC dataset and a conditional split PC dataset by converting the baseline EPM dataset and a conditional split EPM dataset measured from devices manufactured under conditional splits into a PC domain, determining, using the PC-based dataset, respective PCs which are effectively changed by the conditional splits, obtaining split variation information of the conditional splits, extracting an optimal point capable of optimizing a figure of merit of a semiconductor device within a range of the PC-based dataset, and deriving information for process feedback for realizing the optimal point using the split variation information.

G06F 30/27G05B 19/4099G05B 19/41875G06F 30/398G06F2119/18G06F2111/06G06F2111/10G06F 18/23+5 more

Ownership

POSTECH ACADEMY-INDUSTRY FOUNDATION

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