IN-CHAMBER METROLOGY OF SUBSTRATES FOR PROCESS CHARACTERIZATION AND IMPROVEMENT

Patent №

US 12,628,609

Granted

2026-05-12

Filed 2022

Owner

Applied Materials, Inc.

Lab

AI components

0

Assignment

None on record

Dataset

AIPD

Application

17895952

A method includes receiving, by a processing device, first data generated by a first sensor of a substrate processing system. The first data is generated responsive to the first sensor receiving electromagnetic radiation from a substrate held by a robot arm of a transfer chamber in the substrate processing system. The method further includes processing the first data to obtain second data. The second data includes a first indication of performance of the substrate processing system. The method further includes causing, in view of the second data, performance of a corrective actions associated with the substrate processing system.

H10P 72/0604G06N 20/00G06V 10/82G06V 10/774G06V 10/766G06N 3/09G06F 18/217G06F 18/214+6 more

Ownership

Applied Materials, Inc.

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