Patent №
US 4,487,652
Granted
1984-12-11
Filed 1984
Owner
MOTOROLA, INC., A CORP OF DE
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
06595229
A sloped via through polyimide between metal layers is achieved by first sloping a hard mask which overlies the polyimide. Sloped photoresist overlying the hard mask transfers the slope to the hard mask. The sloped hard mask is used to slope the polyimide. Oxide underlying the polyimide is also etched to expose the metal. The underlying oxide layer can be subsequently slope etched.
AI classification
AI hardware0.64
Natural language0.00
Planning0.00
Knowledge representation0.00
Evolutionary computation0.00
Vision0.00
Machine learning0.00
Speech0.00
Ownership
MOTOROLA, INC., A CORP OF DE
assignment · 42450535
Assignors
ALMGREN, CARL W.
On an employer assignment, the assignors are typically the inventors.
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