ENCLOSURE FOR ELECTRONIC COMPONENTS

An enclosure for electronic equipment includes an outer housing having an inner housing mounted therein. The inner housing has a fan and air deflector members mounted therein for maintaining a controlled circulation of air flow within the interior region of the inner housing so that air within the interior region is moved in heat exchange relationship with a heat sink member extending into the inner housing. The heat sink member in the inner housing is connected by thermal diodes with another heat sink member attached to a side wall of the outer housing. Another fan directs an air flow over the heat sink member attached to the side wall of the outer housing. A third fan is mounted within the interior region of the outer housing, but externally of the inner housing, for providing air circulation within the interior region of the outer housing.