Patent №
US 4,725,558
Granted
1988-02-16
Filed 1986
Owner
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Lab
—
AI components
1
hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
06927501
An improved semiconductor defects curing method and apparatus are disclosed which is free from current leakage due to pin-holes or other defects. Also an improved method for processing a semiconductor device is shown. According to the invention, the gaps or holes in the semiconductor layer produced in the fabrication process are filled with insulator in advance of deposition of electrodes.
AI classification
Ownership
SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
assignment · 46270583
Assignors
YAMAZAKI, SHUNPEI, SUZUKI, KUNIO, KINKA, MIKIO, FUKADA, TAKESHI, ABE, MASAYOSHI, KOBAYASHI, IPPEI, SHIBATA, KATSUHIKO, SUSUKIDA, MASATO, NAGAYAMA, SUSUMU, KOYANAGI, KAORU
On an employer assignment, the assignors are typically the inventors.