FIBER OPTIC SOLDER JOINT INSPECTION SYSTEM

The invention is an automated solder joint inspection system for determining the quality of a specular soldered joint through examination of the shape of the joint surface using a series of point light sources and the associated highlight reflections from the joint surface. The light from the point light sources, which is directed toward the solder joint, is reflected in a pattern from the solder joint to an array of light responsive transducers, such as a camera, at a fixed location. Utilizing the intensity values from the light responsive transducer array, a binary grid map is generated for the reflections from each point light source. Using known surface features of solder joints along with curve fitting techniques, a series of grid maps may be mathematically interpreted to reconstruct the solder joint surface. A rule-based system, through comparison with acceptable solder joint surface features, evaluates and classifies the joint for an acceptability determination.