Patent №
US 5,327,010
Granted
1994-07-05
Filed 1990
Owner
RYODEN KASEI CO., LTD.
+2 more
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
07553459
An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.
AI classification
Ownership
RYODEN KASEI CO., LTD.
assignment · 53860313
MITSUBISHI DENKI KABUSHIKI KAISHA
assignment · 53860313
MITSUBISHI DENKI K.K.
assignment · 75340280
Assignors
UENAKA, TAKESHI, OHBUCHI, JUN, ONODA, SHIGEO, OMORI, MAKOTO, MAEDA, HAJIME, TACHIKAWA, TORU
On an employer assignment, the assignors are typically the inventors.