DOUBLE-SIDED PLACEMENT OF COMPONENTS ON PRINTED CIRCUIT BOARD

Patent №

US 5,481,474

Granted

1996-01-02

Filed 1993

Owner

CADENCE DESIGN SYSTEMS, INC.

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

08096604

A computer-aided engineering (CAE) tool simulates physical floor-planning of electronic components to be placed and interconnected on both sides of a printed circuit board (PCB). Initially components are placed in a raw portion of the PCB, until an evaluator determines where to re-place selected components in refined portions on both sides of the PCB. The evaluation process is repeated until all components are selected from the raw portion and re-placed in a refined portion. During evaluation, a profile of the raw portion is generated, and the generated profile is searched for a location for placing each selected component.

PlanningG06F 30/392H05K 3/0005H05K 13/085H05K 3/303H05K 2203/1572

AI classification

Planning0.84
Evolutionary computation0.06
Knowledge representation0.03
AI hardware0.02
Natural language0.01
Machine learning0.00
Vision0.00
Speech0.00

Ownership

CADENCE DESIGN SYSTEMS, INC.

assignment · 68660004

Assignors

LEE, TSU-CHANG

On an employer assignment, the assignors are typically the inventors.

From the same owner

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