METHOD AND APPARATUS FOR LOCATING AND FACILITATING THE REPAIR OF DEFECTS ON A PRINTED CIRCUIT BOARD

A video camera is suspended over a printed circuit board for repair by an XY positioning system which permits the camera to be moved into desired positions over the printed circuit board, in alignment with detected defects which have been identified on the printed circuit board, so that an operator is advised of the location of each defect on a conveniently positioned monitor. The image displayed on the monitor can then be used in actually performing the desired repair. The result is an integrated operation which permits the location of detected defects, as well as their repair, without requiring the operator to divert attention from the repair procedures which are then underway. If desired, the image which is present on the monitor can be magnified to facilitate the operator's repairs, and to enhance any inspections required in conjunction with such repairs.