SOL-GEL BONDING SOLUTION FOR ANODIC BONDING

A method of bonding two electrically conductive substrates together includes the steps of forming a dielectric layer between the substrates, with the layer being formed from a sol-gel solution. Through the application of a constant voltage an ionic depletion region is created in the dielectric layer. After the step of creating the ionic depletion region, the dielectric layer and substrates are heated such that an oxygen depletion region is created in one of the substrates. The sol-gel solution includes sodium aluminoborosilicate having about 75-90 mol % SiO.sub.2, about 5-20 mol % B.sub.2 O.sub.3, about 1-10 mol % Na.sub.2 O and about 0-5 mol % Al.sub.2 O.sub.3.