SYSTEM AND METHOD FOR ARITHMETIC OPERATIONS FOR ELECTRONIC PACKAGE INSPECTION

An inspection system and method uses a first illumination apparatus to illuminate one or more features, such as solder balls on an electronic component or other protruding surfaces or features on an object being inspected. Once the object being inspected is illuminated, a first reflected image of the plurality of features is captured by an illumination detection device. The first reflected image is stored in an image buffer. The object being inspected is then illuminated by at least one additional illumination apparatus. Each additional illumination apparatus is selected so that it differs from the other illumination apparatuses in either geometrical arrangement, degree of diffusion or illumination characteristic. An additional reflected image of the object is then captured by the illumination detection device while the object is illuminated by each additional illumination apparatus. Each additional reflected image is also stored in an image buffer. Once at least two reflected images are captured and stored in the image buffer, they are combined by an image processor using at least one arithmetic operation to create a resulting image in which at least one selected feature is enhanced. The enhanced features appearing on the resulting image can then be inspected using additional image processing equipment using standard image analysis techniques.