METHOD FOR DETECTING AND CATEGORIZING DEFECTS

A defect categorization method is described. Two or more regions are defined on a die. These regions can be repeated for other dies on the same wafer or corresponding regions on other dies on other wafers. The wafer(s) are scanned for defects. The location of each defect, along with any other desired defect data is stored. The stored defect data is then categorizing by region or regions within a die. As a result of the categorization, optional defect generation predictions can be made or optional yield or kill ratio predictions can be made. Also, specific regions(s) can be rescanned based on the result of the categorization.