METHOD OF ALIGNING DIES OF WAFER(S) WITH EXPOSURE EQUIPMENT IN THE FABRICATING OF SEMICONDUCTOR DEVICES

A method of exposing the dies of a wafer using the technique of photolithography corrects the deviations that would otherwise occur between the states of alignment of the dies and photolithography exposure equipment. An initial state of alignment of each of the dies of a sample wafer and an exposure device is inspected. The inspection is used to generate raw data of any deviation between the initial states of alignment and ideal states of alignment. The raw data is mapped, and stored as processed data. Both the processed data and basic data concerning the sample wafer are used to produce a preliminary job file that establishes the basic setting of the exposure equipment. Also, a correction deviation value is generated for each of the dies of the sample wafer except for those dies that will be positioned at the ideal position of alignment under the basic setting of the exposure device. The preliminary job file is changed on the basis of the correction deviation values to thereby form a final job file. Then, each of the dies of the sample wafer are exposed under the direction of the final job file.