METHOD FOR ADDING REDUNDANT VIAS ON VLSI CHIPS

Patent №

US 6,715,133

Granted

2004-03-30

Filed 2003

Owner

Lab

AI components

1

hardware

Assignment

None on record

Dataset

AIPD

2023_r1 edition

Application

10345559

A method is shown which replaces single vias with redundant vias on candidate signals on a semiconductor integrated circuit chip. Where limited space prevents such replacement on more than one signal wire, the method assigns priority to the via through which more current must flow to charge or discharge capacitance. This prioritization reduces the magnitude of delay anomalies arising from vias containing process related resistance defects.

AI hardwareH01L 21/76838H10W 20/031H01L 23/5226H01L 2924/0002H10W 20/42

AI classification

AI hardware0.97
Machine learning0.10
Knowledge representation0.00
Evolutionary computation0.00
Vision0.00
Planning0.00
Natural language0.00
Speech0.00
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