Patent №
US 6,715,133
Granted
2004-03-30
Filed 2003
Owner
—
Lab
—
AI components
1
hardware
Assignment
None on record
Dataset
AIPD
2023_r1 edition
Application
10345559
A method is shown which replaces single vias with redundant vias on candidate signals on a semiconductor integrated circuit chip. Where limited space prevents such replacement on more than one signal wire, the method assigns priority to the via through which more current must flow to charge or discharge capacitance. This prioritization reduces the magnitude of delay anomalies arising from vias containing process related resistance defects.