Patent №
US 6,969,308
Granted
2005-11-29
Filed 2003
Owner
TOKYO SEIMITSU CO., LTD.
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
10437408
A polishing device is hermetically accommodated in a chamber containing an atmosphere having a composition different from the ambient air, so that the atmosphere around the polishing device is altered into the composition different from the ambient air, and voltage is applied between a wafer and a polishing pad to polish the wafer with an electrolytic effect. The polishing device has the atmosphere containing extremely less oxygen, preventing a surface of the wafer from oxidation and thereby providing a constant polishing rate.
AI classification
Ownership
TOKYO SEIMITSU CO., LTD.
assignment · 142740588
Assignors
FUJITA, TAKASHI
On an employer assignment, the assignors are typically the inventors.