METHOD FOR MEASURING A CHARACTERISTIC DIMENSION OF AT LEAST ONE PATTERN ON A DISC -SHAPED OBJECT IN A MEASURING INSTRUMENT

The measurement of the width of a pattern on a semiconductor wafer or a flat panel is carried out in an optical microscope or a scanning electron microscope in a number of measuring steps, By a computing rule, the quality of the correlation between the measured data obtained in the individual measurement steps, as well as reference data taken from the design, the value for the parameter is calculated and compared with a limiting value obtained from experience. In the event of violation of the limiting value, a signal is generated and the further processing of the object is interrupted.