METHOD AND SYSTEM FOR COOLING ELECTRONIC COMPONENTS

Patent №

US 6,987,370

Granted

2006-01-17

Filed 2003

Owner

HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.

+1 more

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

10602972

A localized system for dissipating heat generated by an electronic component includes a controllable cooling element and a control system for controlling the cooling element. The control system adjusts a speed of operation of the cooling element in response to variations in power consumption of the electronic component.

PlanningG06F 1/206G06F 1/3203Y02D 10/00

AI classification

Planning0.84
Evolutionary computation0.03
Knowledge representation0.00
Machine learning0.00
Natural language0.00
Vision0.00
Speech0.00
AI hardware0.00

Ownership

HEWLETT-PACKARD DEVELOPMENT COMPANY L.P.

assignment · 145970616

SK HYNIX INC.

assignment · 430820469

Assignors

CHHEDA, SACHIN NAVIN, BARSUN, STEPHAN KARL, ESPINOZA-IBARRA, RICARDO E.

On an employer assignment, the assignors are typically the inventors.

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