MULTICHIP MODULE AND MULTICHIP SHUTDOWN METHOD

Patent №

US 7,006,341

Granted

2006-02-28

Filed 2003

Owner

SONY CORPORATION

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

10631639

In the multichip module and shutdown method thereof, there are provided a semiconductor chip for voltage regulation which shuts itself down at a first setup temperature and a semiconductor chip for amplifier which is disposed in a common package together with the semiconductor chip for voltage regulation and shuts itself down at a second setup temperature. The semiconductor chip for voltage regulation is provided with means for outputting via a bus a signal for compulsorily shutting down the semiconductor chip for amplifier when the semiconductor chip for voltage regulation reaches a third setup temperature lower than the first setup temperature.

AI hardwareH01L 23/34H10W 40/00H01L 2924/0002

AI classification

AI hardware0.81
Machine learning0.09
Natural language0.00
Knowledge representation0.00
Vision0.00
Evolutionary computation0.00
Planning0.00
Speech0.00

Ownership

SONY CORPORATION

assignment · 148350556

Assignors

NISHINO, YASUJI

On an employer assignment, the assignors are typically the inventors.

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