Patent №
US 7,202,898
Granted
2007-04-10
Filed 2001
Owner
3DV SYSTEMS, LTD.
Lab
—
AI components
2
vision · hardware
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
09868405
A semiconductor surface is provided comprising a plurality of light sensitive pixels wherein each pixel of the plurality of pixels comprises an electronic circuit formed on or in the semiconductor surface, the circuit comprising: a photosensor that generates a signal responsive to light incident thereon at an output thereof; and circuitry that provides a signal responsive to a time lapse between a first time responsive to said signal and a reference time. There is also provided a 3D camera incorporating the semiconductor surface.
AI classification
Ownership
3DV SYSTEMS, LTD.
assignment · 119800004
Assignors
BRAUN, ORI J., IDDAN, GAVRIEL J., YAHAV, GIORA
On an employer assignment, the assignors are typically the inventors.