MODELING SUBSTRATE NOISE COUPLING USING SCALABLE PARAMETERS

Patent №

US 7,203,629

Granted

2007-04-10

Filed 2003

Owner

STATE OF OREGON ACTING BY AND THROUGH THE OREGON STATE BOARD OF HIGHER EDUCATION ON BEHALF OF OREGON STATE UNIVERSITY, THE

Lab

AI components

1

hardware

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

10683575

Methods and apparatus for substrate modeling are disclosed. In one disclosed method, for example, the substrate modeling comprises determining scalable Z parameters associated with at least two substrate contacts, constructing a matrix of the scalable Z parameters for the at least two substrate contacts, and calculating an inverse of the matrix to determine resistance values associated with the at least two substrate contacts. Computer-readable media containing computer-executable instructions for causing a computer system to perform any of the described methods are also disclosed.

AI classification

AI hardware0.50
Machine learning0.00
Vision0.00
Knowledge representation0.00
Natural language0.00
Evolutionary computation0.00
Planning0.00
Speech0.00

Ownership

STATE OF OREGON ACTING BY AND THROUGH THE OREGON STATE BOARD OF HIGHER EDUCATION ON BEHALF OF OREGON STATE UNIVERSITY, THE

assignment · 143620586

Assignors

OZIS, DICLE, MAYARAM, KARTIKEYA, FIEZ, TERRI

On an employer assignment, the assignors are typically the inventors.

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