BENDING PROCESS ESTIMATION APPARATUS, BENDING PROCESS ESTIMATION PROGRAM, AND BENDING PROCESS ESTIMATION METHOD
Patent №
US 7,254,459
Granted
2007-08-07
Filed 2005
Owner
FUJITSU LIMTIED
Lab
—
AI components
1
planning
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11318602
The present invention has been made to provide a laser bending process estimation apparatus, a laser bending process estimation program, and a laser bending process estimation method capable of estimating a result of a laser bending process without an actual workpiece. A laser bending process estimation apparatus that estimates a result of a bending process performed using a laser beam comprises: a process condition acquisition section 1 that acquires a process condition of the bending process; an analysis model creation section 3 that creates an analysis model based on the process condition acquired by the process condition acquisition section 1; and an analysis section 5 that performs heat transfer analysis and heat stress analysis based on the analysis model created by the analysis model creation section 3 to calculate an analysis result of the bending process.
AI classification
Ownership
FUJITSU LIMTIED
assignment · 173840227
Assignors
TATENO, TADASHI
On an employer assignment, the assignors are typically the inventors.