BENDING PROCESS ESTIMATION APPARATUS, BENDING PROCESS ESTIMATION PROGRAM, AND BENDING PROCESS ESTIMATION METHOD

Patent №

US 7,254,459

Granted

2007-08-07

Filed 2005

Owner

FUJITSU LIMTIED

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11318602

The present invention has been made to provide a laser bending process estimation apparatus, a laser bending process estimation program, and a laser bending process estimation method capable of estimating a result of a laser bending process without an actual workpiece. A laser bending process estimation apparatus that estimates a result of a bending process performed using a laser beam comprises: a process condition acquisition section 1 that acquires a process condition of the bending process; an analysis model creation section 3 that creates an analysis model based on the process condition acquired by the process condition acquisition section 1; and an analysis section 5 that performs heat transfer analysis and heat stress analysis based on the analysis model created by the analysis model creation section 3 to calculate an analysis result of the bending process.

PlanningG06F 30/20G06F 2113/24G06F 2119/08

AI classification

Planning0.71
Evolutionary computation0.20
Vision0.01
Natural language0.00
AI hardware0.00
Machine learning0.00
Knowledge representation0.00
Speech0.00

Ownership

FUJITSU LIMTIED

assignment · 173840227

Assignors

TATENO, TADASHI

On an employer assignment, the assignors are typically the inventors.

From the same owner

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