X-RAY THIN FILM INSPECTION APPARATUS AND THIN FILM INSPECTION APPARATUS AND METHOD FOR PATTERNED WAFER

An X-ray thin film inspection apparatus including a sample table on which an inspection target such as a product wafer or the like is mounted, a positioning mechanism for moving the sample table, a goniometer having first and second swing arms, at least one X-ray irradiation unit that are mounted on the first swing arm and containing an X-ray tube and an X-ray optical element in a shield tube, an X-ray detector mounted on a second swing arm, and an optical camera for subjecting the inspection target disposed on the sample table to pattern recognition.