INTEGRATED CIRCUIT CONFIGURATION WITH ANALYSIS PROTECTION AND METHOD FOR PRODUCING THE CONFIGURATION

During the creation of wiring plans for logic modules, the regions which are left free of interconnects by synthesis methods in upper metal planes are filled to a maximum degree with further interconnects. These interconnects serve to protect the integrated circuit. These further interconnects, depending on the availability of components for driving or evaluation, are embodied as sensor interconnects or else as connectionless interconnects only to confuse potential hackers.