Patent US 7,340,377

Patent №

US 7,340,377

Granted

Owner

Lab

AI components

1

planning

Assignment

None on record

Dataset

AIPD

2023_r1 edition

Application

11456020

A method of monitoring a single-wafer processing system in real-time using low-pressure based modeling techniques that include processing a wafer in a processing chamber; determining a measured dynamic process response for a rate of change for a process parameter; executing a real-time dynamic model to generate a predicted dynamic process response; determining a dynamic estimation error using a difference between the predicted dynamic process response and the expected process response; and comparing the dynamic estimation error to operational limits.

PlanningG05B 19/41875C23C 16/52G05B 23/0254G05B 2219/37514G05B 2219/37533G05B 2219/45031Y02P 90/02

AI classification

Planning0.93
AI hardware0.31
Machine learning0.25
Evolutionary computation0.10
Knowledge representation0.02
Natural language0.00
Vision0.00
Speech0.00
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