METHOD FOR INSPECTING A PATTERN AND METHOD FOR MANUFACTURING A SEMICONDUCTOR CHIP HAVING A CIRCUIT PATTERN

A method for inspecting a pattern includes measuring, in a first direction, a width of a reference pattern at plural positions in the reference patter; measuring, in a second direction, a width of the reference pattern at the plural positions. Comparing the first and second width and determining which of the first and second widths is shortest; extracting a defect in a pattern to be inspected; and evaluating the extracted defect depending on the determined direction.