METHOD AND SYSTEM FOR DEFECT DETECTION

Patent №

US 7,539,583

Granted

2009-05-26

Filed 2005

Owner

RUDOLPH TECHNOLOGIES, INC.

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11201279

A method for inspecting objects such as semiconductor wafers. A staging platform and an optical platform are arranged so that the object may be staged and its surface scanned by optical equipment situated on the optical platform. During the scanning process, the surface is illuminated with light of a plurality of wavelengths, each strobed at a predetermined rate so that multiple images may be collected using time and frequency multiplexing. The multiple images are stored in a database for analysis, which includes processing selected ones of the multiple images according to one or more algorithms. The defect-detection algorithms used for each object are determined by referenced to a predetermined or calculated defect detection protocol, then a defect mask is created for each pixel in the images that is suspected to be defective. The defect mask is then compared to threshold parameters to determine which if any of the suspected defects should be reported.

AI classification

Vision1.00
Machine learning0.05
Planning0.02
Knowledge representation0.02
Evolutionary computation0.01
Natural language0.00
AI hardware0.00
Speech0.00

Ownership

RUDOLPH TECHNOLOGIES, INC.

assignment · 168380519

Assignors

FU, YONGHANG, LIU, YONGQIANG, DARWIN, MICHAEL J.

On an employer assignment, the assignors are typically the inventors.

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