Patent №
US 7,598,552
Granted
2009-10-06
Filed 2007
Owner
SAMSUNG ELECTRONICS CO., LTD.
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11820170
In an image sensor in which a vertical length from a photoelectric conversion element to an uppermost micro-lens is minimal, and a method of manufacturing the same, the image sensor includes a substrate, a plurality of photoelectric conversion elements, and first to n-level (where n is an integer greater than or equal to 2) metal wires. In the substrate, a sensor region and a peripheral circuit region are defined. The plurality of photoelectric conversion elements are formed in or on the substrate within the sensor region. The first to n-level metal wires are sequentially formed on the substrate. The n-level metal wires within the sensor region are of a thickness that is less than the n-level metal wires within the peripheral circuit region.
AI classification
Ownership
SAMSUNG ELECTRONICS CO., LTD.
assignment · 195060273
Assignors
PARK, BYUNG-JUN
On an employer assignment, the assignors are typically the inventors.