IMAGE SENSOR HAVING IMPROVED SENSITIVITY AND METHOD OF MANUFACTURING THE SAME

Patent №

US 7,598,552

Granted

2009-10-06

Filed 2007

Owner

SAMSUNG ELECTRONICS CO., LTD.

Lab

AI components

1

vision

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11820170

In an image sensor in which a vertical length from a photoelectric conversion element to an uppermost micro-lens is minimal, and a method of manufacturing the same, the image sensor includes a substrate, a plurality of photoelectric conversion elements, and first to n-level (where n is an integer greater than or equal to 2) metal wires. In the substrate, a sensor region and a peripheral circuit region are defined. The plurality of photoelectric conversion elements are formed in or on the substrate within the sensor region. The first to n-level metal wires are sequentially formed on the substrate. The n-level metal wires within the sensor region are of a thickness that is less than the n-level metal wires within the peripheral circuit region.

VisionH10F 39/024H10F 39/806H10F 39/8053H10F 39/8063H10F 39/811

AI classification

Vision0.64
AI hardware0.12
Knowledge representation0.02
Natural language0.00
Planning0.00
Machine learning0.00
Evolutionary computation0.00
Speech0.00

Ownership

SAMSUNG ELECTRONICS CO., LTD.

assignment · 195060273

Assignors

PARK, BYUNG-JUN

On an employer assignment, the assignors are typically the inventors.

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