Patent №
US 7,616,804
Granted
2009-11-10
Filed 2006
Owner
RUDOLPH TECHNOLOGIES, INC.
Lab
—
AI components
1
vision
Assignment
Recorded
Dataset
AIPD
2023_r1 edition
Application
11525530
Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed pixel arrays is generated by compressing each of the pixel arrays in the first dimension and concatenating the pixel arrays. The composite image is analyzed to identify a wafer feature, for example using a sinusoidal line fit.
AI classification
Ownership
RUDOLPH TECHNOLOGIES, INC.
assignment · 185510271
Assignors
PAI, AJAY, LE, TUAN D.
On an employer assignment, the assignors are typically the inventors.