THREE-DIMENSIONAL HIERARCHICAL COUPLING EXTRACTION

Patent №

US 7,669,152

Granted

2010-02-23

Filed 2007

Owner

SILICON FRONTLINE TECHNOLOGY INC.

+1 more

Lab

AI components

1

planning

Assignment

Recorded

Dataset

AIPD

2023_r1 edition

Application

11685630

Apparatus, systems, and methods are provided for processing integrated circuit chip design. A three-dimensional Monte Carlo random-walk process may be applied to a cell in a hierarchical description of the layout of the chip to extract information regarding the cell. The information may include coupling resistance, capacitance, inductance, or combinations thereof. A neighborhood of the cell may be built and data correlated to the neighborhood may be stored. Such a technique may be applied from a bottom level to a top level of the hierarchical description of the chip layout.

AI classification

Planning0.83
AI hardware0.42
Knowledge representation0.17
Vision0.07
Machine learning0.00
Natural language0.00
Evolutionary computation0.00
Speech0.00

Ownership

SILICON FRONTLINE TECHNOLOGY INC.

assignment · 190040764

SYNOPSYS, INC.

assignment · 634490392

Assignors

TCHERENIAEV, ANDREI, FEINBERG, YURI, TCHERNIAEV, ANDREI, FEINBERG, YURI

On an employer assignment, the assignors are typically the inventors.

© 2026 NYSGPT2525 LLC