EXPOSURE OPERATION EVALUATION METHOD FOR EXPOSURE APPARATUS AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE

An exposure operation evaluation method for an exposure apparatus for arranging a predetermined number of at least one evaluation pattern in an overlapping area and printing the at least one evaluation pattern on a substrate when performing a plurality of exposures and printing on the substrate while sequentially step-moving an exposure area in quadrangle, the exposure area having evaluation patterns arranged on an outer peripheral side of a circuit pattern, the overlapping area overlapping respective exposure areas adjacent to four sides of the exposure area, the method including: measuring a printing misalignment between each evaluation pattern of adjacent exposure areas printed on the substrate; and calculating a plurality of linear components in an exposure operation of the exposure apparatus based on the result of the measurement of the printing misalignment and suppressing and controlling the printing misalignment based on the plurality of linear components.